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Product Specification
(Preliminary) Part Name: OEL Display Module Part ID: UG-5664ALBEF01 Doc No.: SAS1-E019-A
Customer:
Approved by
From: Univision Technology Inc.
Approved by
Univision Technology Inc.
8, Kebei RD 2, Science Park, Chu-Nan, Taiwan 350, R.O.C.
Notes: 1. Please contact Univision Technology Inc. before assigning your product based on this module specification 2. The information contained herein is presented merely to indicate the characteristics and performance of our products. No responsibility is assumed by Univision Technology Inc. for any intellectual property claims or other problems that may result from application based on the module described herein.
Univision Technology Inc.
Revised History
Part Number UG-5664ALBEF01 Revision A New Revision Content
Doc. w w w . D a t a S h e e t 4 U . c o m No: SAS1-E019-A
Revised on May 12, 2008
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Notice:
No part of this material may be reproduces or duplicated in any form or by any means without the written permission of Univision Technology Inc. Univision Technology Inc. reserves the right to make changes to this material without notice. Univision Technology Inc. does not assume any liability of any kind arising out of any inaccuracies contained in this material or due to its application or use in any product or circuit and, further, there is no representation that this material is applicable to products requiring high level reliability, such as, medical products. Moreover, no license to any intellectual property rights is granted by implication or otherwise, and there is no representation or warranty that anything made in accordance with this material will be free from any patent or copyright infringement of a third party. This material or portions thereof may contain technology or the subject relating to strategic products under the control of Foreign Exchange and Foreign Trade Law of Taiwan and may require an export license from the Ministry of International Trade and Industry or other approval from another government agency. (c) Univision Technology Inc. 2008, All rights reserved. All other product names mentioned herein are trademarks and/or registered trademarks of their respective companies.
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Revision History ................................................................................................... i Notice ................................................................................................................... ii Contents .............................................................................................................. iii 1. Basic Specifications .................................................................................. 1~6
1.1 1.2 1.3 1.4 1.5 1.6 Display Specifications .................................................................................................1 Mechanical Specifications ...........................................................................................1 Active Area & Pixel Construction ...............................................................................1 Mechanical Drawing....................................................................................................2 Pin Definition...............................................................................................................3 Block Diagram .............................................................................................................6
2. Absolute Maximum Ratings .......................................................................... 7 3. Optics & Electrical Characteristics ......................................................... 8~12
3.1 Optics Characteristics ..................................................................................................8 3.2 DC Characteristics .......................................................................................................8 3.3 AC Characteristics .......................................................................................................9 3.3.1 68XX-Series MPU Parallel Interface Timing Characteristics ...........................9 3.3.2 80XX-Series MPU Parallel Interface Timing Characteristics .........................10 3.3.3 Serial Interface Timing Characteristics (4-wire SPI).......................................11 3.3.4 Serial Interface Timing Characteristics (3-wire SPI).......................................12
4. Functional Specification ....................................................................... 13~14
4.1 Commands .................................................................................................................13 4.2 Power down and Power up Sequence ........................................................................13 4.2.1 Power up Sequence ..........................................................................................13 4.2.2 Power down Sequence .....................................................................................13 4.3 Reset Circuit...............................................................................................................13 4.4 Actual Application Example ......................................................................................14
5. Reliability ...................................................................................................... 15
5.1 Contents of Reliability Tests......................................................................................15 5.2 Lifetime......................................................................................................................15 5.3 Failure Check Standard..............................................................................................15
6. Outgoing Quality Control Specifications .............................................. 16~19
6.1 Environment Required ...............................................................................................16 6.2 Sampling Plan ............................................................................................................16 6.3 Criteria & Acceptable Quality Level .........................................................................16 6.3.1 Cosmetic Check (Display Off) in Non-Active Area ........................................16 6.3.2 Cosmetic Check (Display Off) in Active Area.................................................18 6.3.3 Pattern Check (Display On) in Active Area.....................................................19
7. Package Specifications ................................................................................ 20
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8.1 8.2 8.3 8.4 8.5
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8. Precautions When Using These OEL Display Modules ....................... 21~23
Handling Precautions .................................................................................................21 Storage Precautions....................................................................................................22 Designing Precautions ...............................................................................................22 Precautions when disposing of the OEL display modules.........................................23 Other Precautions.......................................................................................................23
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1. Basic Specifications
1.1 Display Specifications 1) 2) 3) Display Mode: Display Color: Drive Duty: Passive Matrix Monochrome (Light Blue) 1/64 Duty
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1.2 Mechanical Specifications 1) 2) 3) 4) 5) 6) 7) Outline Drawing: Number of Pixels: Panel Size: Active Area: Pixel Pitch: Pixel Size: Weight: According to the annexed outline drawing 256 x 64 88.00 x 27.80 x 2.00 (mm) 76.78 x 19.18 (mm) 0.30 x 0.30 (mm) 0.28 x 0.28 (mm) 9.95 (g)
1.3 Active Area & Pixel Construction
P0.30x256-0.02=76.78 (A/A) 0.3 0.28
P0.30x64-0.02=19.18 (A/A)
Segment 112
( Column 1 )
Segment 357
( Column 256 )
Segment 239
( Column 128 )
Segment 240
( Column 129 )
Common A0
( Row 64 )
Common B0
( Row 64 )
0.3 0.28 Detail "A" Scale (10:1)
Common A63
( Row 1 )
Common B63
( Row 1 )
1
Item A Remark Original Drawing
Date 20080401
3.50.5 (4.61) (5.61) Remove Tape t=0.15mm Max 10 5 20.1
880.3 (Panel Size) 880.3 (Cap Size) 810.3 (Polarizer) 78.78 (V/A) P0.30x256-0.02=76.78 (A/A)
1.4 Mechanical Drawing
(3) (2) 10.5 Segment 112
( Column 1 )
Segment 357
( Column 256 )
8
"A" (11.9) Common A0
( Row 64 )
Segment 239
( Column 128 )
Segment 240
( Column 129 )
Common B0
( Row 64 )
(20.9)
( Row 1 )
Common A63 (29.3)
Common B63
( Row 1 )
P0.30x64-0.02=19.18 (A/A) 21.18 (V/A) 23.30.3 (Polarizer) 25.80.3 (Cap Size) 27.80.3 (Panel Size)
Active Area 3.12" 256 x 64 Pixels
Polarizer t=0.2mm
N .C. (G ND)
N .C.
V SS
V CC
V COMH
V LSS
D7
D6
D5
D4
D3
D2
D1
D0
E/RD#
R/W#
BS0
BS1
DC#
CS#
RES#
FR
IREF
V DDIO
VD D
V CI
VSL
V LSS
P0.50x(30-1)=14.50.05 (W0.30 0.03)
V CC
N .C. (G ND)
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(47.8) (1.5) Glue (2.6) 40.5 (Stiffener) 2-R0.50.05 Contact Side
1 30
200.3 15.50.2 400.1 600.2
9 9.5 10.62
0.3 0.28
Notes:
The drawing contained herein is the exclusive property of Univision. It is not allowed to copy, reproduce and or disclose in any formats without permission of Univision.
1. Color: Light Blue 2. Driver IC: SSD1322 3. Die Size: 12374um x 1526um 4. TCP Number: SSD1322U 5. Interface: 8-bit 68XX/80XX Parallel, 4-wire SPI 6. General Tolerance: 0.30 7. The total thickness (2.10 Max) is without polarizer protective film & remove tape. The actual assembled total thickness with above materials should be 2.35 Max.
3 4.66
0.30.3 0.80 Max
0.28 0.3
(14)
Detail "A" Scale (10:1)
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
Symbol N.C. (GND) VSS VCC VCOMH VLSS D7 D6 D5 D4 D3 D2 D1 D0 E/RD# R/W# BS0 BS1 DC# CS# RES# FR IREF N.C. VDDIO VDD VCI VSL VLSS VCC N.C. (GND)
Customer Approval Signature
Unless Otherwise Specified
Univision Technology Inc.
Unit
General Roughness
Drawing Number DMG5664CNCF19
Rev. A Material mm Title UG-5664ALBEF01 Folding Type OEL Display Module Pixel Number: 256 x 64, Monochrome, COF Package Soda Lime / Polyimide Tolerance Dimension 0.30 Angle 1 By Date Drawn Humphrey Lin 20080401 E.E. Ting-Kuo Hu 20080401 Panel / E. Ivy Lo 20080401 P.M. Cherry Lin 20080401 Scale 1:1 Sheet 1 of 1 Size A3
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1.5 Pin Definition Pin Number Power Supply Power Supply for Operation 26 VCI P Symbol Type
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Function
This is a voltage supply pin. It must be connected to external source & always be equal to or higher than VDD & VDDIO.
Power Supply for Core Logic Circuit 25 VDD P
This is a voltage supply pin. It can be supplied externally (within the range of 2.4~2.6V) or regulated internally from VCI. A capacitor should be connected between this pin & VSS under all circumstances.
Power Supply for I/O Pin 24 VDDIO P
This pin is a power supply pin of I/O buffer. It should be connected to VDD or external source. All I/O signal should have VIH reference to VDDIO. When I/O signal pins (BS0~BS1, D0~D7, control signals...) pull high, they should be connected to VDDIO.
Ground of Logic Circuit 2 3, 29 5, 28 Driver Current Reference for Brightness Adjustment 22 IREF I
This pin is segment current reference pin. A resistor should be connected between this pin and VSS. Set the current lower than 10uA.
VSS VCC VLSS
P P P
This is a ground pin. It also acts as a reference for the logic pins. It must be connected to external ground.
Power Supply for OEL Panel
These are the most positive voltage supply pin of the chip. They must be connected to external source.
Ground of Analog Circuit
These are the analog ground pins. connected to VSS externally. They should be
Voltage Output High Level for COM Signal 4 VCOMH P
This pin is the input pin for the voltage output high level for COM signals. A tantalum capacitor should be connected between this pin and VSS.
Voltage Output Low Level for SEG Signal 27 VSL P
This is segment voltage reference pin. When external VSL is not used, this pin should be left open. When external VSL is used, this pin should connect with resistor and diode to ground.
Testing Pads Frame Frequency Triggering Signal 21 FR O
This pin will send out a signal that could be used to identify the driver status. Nothing should be connected to this pin. It should be left open individually.
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1.5 Pin Definition (Continued) Pin Number Interface Symbol I/O
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Function Communicating Protocol Select
16 17
BS0 BS1
I
These pins are MCU interface selection input. See the following table: BS0 BS1 3-wire SPI 1 0 4-wire SPI 0 0 8-bit 68XX Parallel 1 1 8-bit 80XX Parallel 0 1
Power Reset for Controller and Driver 20 19 RES# CS# I I
This pin is reset signal input. When the pin is low, initialization of the chip is executed.
Chip Select
This pin is the chip select input. The chip is enabled for MCU communication only when CS# is pulled low.
Data/Command Control 18 D/C# I
This pin is Data/Command control pin. When the pin is pulled high, the input at D7~D0 is treated as display data. When the pin is pulled low, the input at D7~D0 will be transferred to the command register. For detail relationship to MCU interface signals, please refer to the Timing Characteristics Diagrams.
Read/Write Enable or Read
This pin is MCU interface input. When interfacing to a 68XX-series microprocessor, this pin will be used as the Enable (E) signal. Read/write operation is initiated when this pin is pulled high and the CS# is pulled low. When connecting to an 80XX-microprocessor, this pin receives the Read (RD#) signal. Data read operation is initiated when this pin is pulled low and CS# is pulled low. When serial mode is selected, this pin must be connected to VSS.
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E/RD#
I
Read/Write Select or Write
This pin is MCU interface input. When interfacing to a 68XX-series microprocessor, this pin will be used as Read/Write (R/W#) selection input. Pull this pin to "High" for read mode and pull it to "Low" for write mode. When 80XX interface mode is selected, this pin will be the Write (WR#) input. Data write operation is initiated when this pin is pulled low and the CS# is pulled low. When serial mode is selected, this pin must be connected to VSS.
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R/W#
I
Host Data Input/Output Bus 6~13 D7~D0 I/O
These pins are 8-bit bi-directional data bus to be connected to the microprocessor's data bus. When serial mode is selected, D1 will be the serial data input SDIN and D0 will be the serial clock input SCLK. Unused pins must be connected to VSS except for D2 in serial mode.
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1.5 Pin Definition (Continued) Pin Number Reserve Reserved Pin 23 N.C. Symbol I/O
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Function
The N.C. pin between function pins are reserved for compatible and flexible design.
Reserved Pin (Supporting Pin) 1, 30 N.C. (GND) The supporting pins can reduce the influences from stresses on the function pins. These pins must be connected to external ground.
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1.6 Block Diagram
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Active Area 3.12" 256 x 64 Pixels
Common A63 Segment 112 Segment 357 Common B63 Common A0 Common B0
~
~~~
~
SSD1322
VSS VCC VCOMH ~ E/RD# R/W# BS0 BS1 D/C# CS# RES# FR IREF VDDIO VDD VCI VSL VLSS VCC C7 C3 C4 C8 R1 C1 C2 D1 R2 VLSS D7 D0
C5 C6
MCU Interface Selection: BS0 and BS1 Pins connected to MCU interface: D7~D0, E/RD#, R/W#, D/C#, CS#, and RES# C1, C3, C5: 0.1F C2, C4: 4.7F C6: 10F C7: 1F C8: 4.7uF / 25V Tantalum Capacitor R1: 680k, R1 = (Voltage at IREF - VSS) / IREF R2: 50, 1/4W D1: 1.4V, 0.5W
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2. Absolute Maximum Ratings
Parameter Supply Voltage for Operation Supply Voltage for Logic Supply Voltage for I/O Pins Supply Voltage for Display Operating Current for VCC Operating Temperature Storage Temperature Symbol VCI VDD VDDIO VCC ICC TOP TSTG Min -0.3 -0.5 -0.5 -0.5 -30 -40 Max 4 2.75 VCI 16 55 85 90
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Unit V V V V mA C C
Notes 1, 2 1, 2 1, 2 1, 2 1, 2 -
Note 1: All the above voltages are on the basis of "VSS = 0V". Note 2: When this module is used beyond the above absolute maximum ratings, permanent breakage of the module may occur. Also, for normal operations, it is desirable to use this module under the conditions according to Section 3. "Optics & Electrical Characteristics". If this module is used beyond these conditions, malfunctioning of the module can occur and the reliability of the module may deteriorate.
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3. Optics & Electrical Characteristics
3.1 Optics Characteristics Characteristics Brightness C.I.E. (Blue) Dark Room Contrast View Angle Symbol Lbr (x) (y) CR Conditions With Polarizer (Note 3) Without Polarizer Min 60
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Typ 80
Max Unit cd/m2
0.12 0.16 0.20 0.22 0.26 0.30 - >2000:1 >160 degree
* Optical measurement taken at VCI = 2.8V, VCC = 12V. Software configuration follows Section 4.4 Initialization.
3.2 DC Characteristics Characteristics Supply Voltage for Operation Supply Voltage for Logic Supply Voltage for Display High Level Input Low Level Input High Level Output Low Level Output Operating Current for VCI Operating Current for VCC Symbol VCI VDD VCC VIH VIL VOH VOL ICI ICC Note 3 Conditions Min 2.4 2.4 1.65 11.5 0.8xVDDIO 0 Iout = 100A, 3.3MHz 0.9xVDDIO Iout = 100A, 3.3MHz 0 Note 4 Note 5 Note 4 Note 5 Typ 2.8 2.5 1.8 12 Max Unit 3.5 2.6 VCI 12.5 VDDIO 0.2xVDDIO VDDIO V V V V V V V
Supply Voltage for I/O Pins VDDIO
0.1xVDDIO V 1.8 2.25 mA 1.8 26.3 41.1 1 1 2.25 32.9 51.4 5 5 mA mA mA A A
Sleep Mode Current for VCI ICI, SLEEP Sleep Mode Current for VCC ICC, SLEEP
Note 3: Brightness (Lbr) and Supply Voltage for Display (VCC) are subject to the change of the panel characteristics and the customer's request. Note 4: VCI = 2.8V, VCC = 12V, 50% Display Area Turn on. Note 5: VCI = 2.8V, VCC = 12V, 100% Display Area Turn on. * Software configuration follows Section 4.4 Initialization.
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3.3 AC Characteristics
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3.3.1 68XX-Series MPU Parallel Interface Timing Characteristics: Symbol Description tcycle tAS tAH tDSW tDHW tDHR tOH tACC PWCSL PWCSH tR tF Clock Cycle Time Address Setup Time Address Hold Time Write Data Setup Time Write Data Hold Time Read Data Hold Time Output Disable Time Access Time Chip Select Low Pulse Width (Read) Chip Select Low Pulse Width (Write) Chip Select High Pulse Width (Read) Chip Select High Pulse Width (Write) Rise Time Fall Time Min 300 10 0 40 7 20 120 60 60 60 Max 70 140 15 15 Unit ns ns ns ns ns ns ns ns ns ns ns ns
* (VDD - VSS = 2.4V to 2.6V, VDDIO = 1.6V, VCI = 2.8V, Ta = 25C)
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Symbol Description tcycle tAS tAH tDSW tDHW tDHR tOH tACC tPWLR tPWLW tPWHR tPWHW tCS tCSH tCSF tR tF Clock Cycle Time Address Setup Time Address Hold Time Write Data Setup Time Write Data Hold Time Read Data Hold Time Output Disable Time Access Time Read Low Time Write Low Time Read High Time Write High Time Chip Select Setup Time Chip Select Hold Time to Read Signal Chip Select Hold Time Rise Time Fall Time
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3.3.2 80XX-Series MPU Parallel Interface Timing Characteristics: Min 300 10 0 40 7 20 150 60 60 60 0 0 20 Max 70 140 15 15 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
* (VDD - VSS = 2.4V to 2.6V, VDDIO = 1.6V, VCI = 2.8V, Ta = 25C)
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3.3.3 Serial Interface Timing Characteristics: (4-wire SPI) Symbol Description tcycle tAS tAH tCSS tCSH tDSW tDHW tCLKL tCLKH tR tF Clock Cycle Time Address Setup Time Address Hold Time Chip Select Setup Time Chip Select Hold Time Write Data Setup Time Write Data Hold Time Clock Low Time Clock High Time Rise Time Fall Time
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Min 100 15 15 20 10 15 15 20 20 -
Max 15 15
Unit ns ns ns ns ns ns ns ns ns ns ns
* (VDD - VSS = 2.4V to 2.6V, VDDIO = 1.6V, VCI = 2.8V, Ta = 25C)
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3.3.4 Serial Interface Timing Characteristics: (3-wire SPI) Symbol Description tcycle tAS tAH tCSS tCSH tDSW tDHW tCLKL tCLKH tR tF Clock Cycle Time Address Setup Time Address Hold Time Chip Select Setup Time Chip Select Hold Time Write Data Setup Time Write Data Hold Time Clock Low Time Clock High Time Rise Time Fall Time
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Min 100 15 15 20 10 15 15 20 20 -
Max 15 15
Unit ns ns ns ns ns ns ns ns ns ns ns
* (VDD - VSS = 2.4V to 2.6V, VDDIO = 1.6V, VCI = 2.8V, Ta = 25C)
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4. Functional Specification
4.1. Commands Refer to the Technical Manual for the SSD1322
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4.2 Power down and Power up Sequence To protect OEL panel and extend the panel life time, the driver IC power up/down routine should include a delay period between high voltage and low voltage power sources during turn on/off. It gives the OEL panel enough time to complete the action of charge and discharge before/after the operation. 4.2.1 Power up Sequence: 1. 2. 3. 4. 5. 6. Power up VCI & VDDIO Send Display off command Initialization Clear Screen Power up VCC Delay 100ms (When VCC is stable) 7. Send Display on command 4.2.2 Power down Sequence: 1. Send Display off command 2. Power down VCC 3. Delay 100ms (When VCC is reach 0 and panel is completely discharges) 4. Power down VCI & VDDIO 4.3 Reset Circuit When RES# input is low, the chip is initialized with the following status: 1. Display is OFF 2. 480x128 Display Mode 3. Normal segment and display data column and row address mapping (SEG0 mapped to column address 00h and COM0 mapped to row address 00h) 4. Display start line is set at display RAM address 0 5. Column address counter is set at 0 6. Normal scan direction of the COM outputs 7. Contrast control registers is set at 7Fh
VCI ,VDDIO on VCC on Display on VCC VCI/VDDIO VSS/Ground
Display off VCC off VCI ,VDDIO off VCC VCI/VDDIO VSS/Ground
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4.4 Actual Application Example Command usage and explanation of an actual example
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Command Lock 0xFD, 0x12
Set GPIO 0xB5, 0x00
Enhance Driving Scheme Capability 0xD1, 0x82, 0x20
Sleep In 0xAE
Function Selection 0xAB, 0x01
Set Pre-Charge Voltage 0xBB, 0x1F
Set Display Clock Divide Ratio/Oscillator Frequency
0xB3, 0x91
Enable External VSL 0xB4, 0xA0, 0xFD
Set Second Pre-Charge Period 0xB6, 0x08
Set Multiplex Ratio 0xCA, 0x3F
Set Contrast Current 0xC1, 0x9F
Set VCOMH Deselect Level 0xBE, 0x07
Set Display Offset 0xA2, 0x00
Master Contrast Current Control 0xC7, 0x0F
Set Display Mode 0xA6
Set Display Start Line 0xA1, 0x00
Select Default Linear Gray Scale Table
0xB9
Clear Screen
Set Re-Map & Dual COM Line Mode
0xA0, 0x14, 0x11
Set Phase Length 0xB1, 0xE2
Sleep Out 0xAF
If the noise is accidentally occurred at the displaying window during the operation, please reset the display in order to recover the display function.
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5. Reliability
5.1 Contents of Reliability Tests Item High Temperature Operation Low Temperature Operation High Temperature Storage Low Temperature Storage Conditions 85C, 500 hrs -30C, 500 hrs 90C, 500 hrs -40C, 500 hrs
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Criteria
The operational functions work.
High Temperature/Humidity Storage 60C, 90% RH, 500 hrs -40C 85C, 100 cycles Thermal Shock 30 mins dwell * The samples used for the above tests do not include polarizer. * No moisture condensation is observed during tests.
5.2 Lifetime End of lifetime is specified as 50% of initial brightness reached. Parameter Storage Life Time Min 20,000 Max Unit hr hr Condition 80 cd/m2, 50% Checkerboard Ta = 25C, 50% RH Notes 6 Operating Life Time 10,000
Note 6: The average operating lifetime at room temperature is estimated by the accelerated operation at high temperature conditions.
5.3 Failure Check Standard After the completion of the described reliability test, the samples were left at room temperature for 2 hrs prior to conducting the failure test at 235C; 5515% RH.
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6. Outgoing Quality Control Specifications
6.1 Environment Required Customer's test & measurement are required to be conducted conditions: Temperature: Humidity: Fluorescent Lamp: Distance between the Panel & Lamp: Distance between the Panel & Eyes of the Inspector: Finger glove (or finger cover) must be worn by the inspector. Inspection table or jig must be anti-electrostatic.
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under the following 23 5C 55 15 %RH 30W 50 cm 30 cm
6.2 Sampling Plan Level II, Normal Inspection, Single Sampling, MIL-STD-105E
6.3 Criteria & Acceptable Quality Level Partition Major Minor AQL 0.65 1.0 Definition Defects in Pattern Check (Display On) Defects in Cosmetic Check (Display Off)
6.3.1 Cosmetic Check (Display Off) in Non-Active Area Check Item Classification Criteria X > 6 mm (Along with Edge) Y > 1 mm (Perpendicular to edge)
X
Panel General Chipping
Minor
Y
X
Y
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Check Item Classification
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6.3.1 Cosmetic Check (Display Off) in Non-Active Area (Continued) Criteria Any crack is not allowable.
Panel Crack
Minor
Cupper Exposed (Even Pin or Film)
Minor
Not Allowable by Naked Eye Inspection
Film or Trace Damage
Minor
Glue or Contamination on Pin (Couldn't Be Removed by Alcohol)
Minor
Terminal Lead Prober Mark
Acceptable
Ink Marking on Back Side of panel (Exclude on Film)
Acceptable
Ignore for Any
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6.3.2 Cosmetic Check (Display Off) in Active Area
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It is recommended to execute in clear room environment (class 10k) if actual in necessary. Classification Check Item Any Dirt & Scratch on Acceptable Polarizer's Protective Film Scratches, Fiber, Line-Shape Defect Minor (On Polarizer) Dirt, Black Spot, Foreign Material, Minor (On Polarizer) Criteria Ignore for not Affect the Polarizer W 0.1 Ignore W > 0.1, L 2 n1 L>2 n=0 0.1 Ignore 0.1 < 0.25 n1 0.25 < n=0 0.5 Ignore if no Influence on Display 0.5 < n=0
Dent, Bubbles, White spot (Any Transparent Spot on Polarizer)
Minor
Fingerprint, Flow Mark Minor Not Allowable (On Polarizer) * Protective film should not be tear off when cosmetic check. ** Definition of W & L & (Unit: mm): = (a + b) / 2
L
b: Minor Axis W a: Major Axis
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6.3.3 Pattern Check (Display On) in Active Area Check Item Classification
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Criteria
No Display
Major
Missing Line
Major
Pixel Short
Major
Darker Pixel
Major
Wrong Display
Major
Un-uniform
Major
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7. Package Specifications
EPE COVER FOAM 351x212x1, ANTISTATIC x 1 Pcs x 1 pcs (Empty)
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16 Pcs Tray Vacuum packing B Module x 15 pcs A Staggered Stacking EPE PROTECTTIVE
Tray 420x285 T=0.8mm
Exsiccator x 2 pcs Brimary Primary Box 4 SET C SET
Wrapped with adhesive tape x 16 pcs B
Vacuum packing bag
EPE PROTECTTIVE 370mm x 280mm x 20mm
CARTON BOX
Label
Primary L450mm x W296 x H110, B wave xC 4Pcs
Univision Technology Inc. Part ID :
Label
Lot ID : Q'ty : QC :
Carton Box L464mm x W313mm x H472mm, AB wave
(Major / Maximum)
Item Holding Trays Total Trays Primary Box (A) (B) (C) 15 16 1~4
Quantity per Primary Box per Primary Box (Including 1 Empty Tray) per Carton (4 as Major / Maximum)
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8. Precautions When Using These OEL Display Modules
8.1 Handling Precautions 1) 2) 3)
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4) 5)
6)
Since the display panel is being made of glass, do not apply mechanical impacts such us dropping from a high position. If the display panel is broken by some accident and the internal organic substance leaks out, be careful not to inhale nor lick the organic substance. If pressure is applied to the display surface or its neighborhood of the OEL display module, the cell structure may be damaged and be careful not to apply pressure to these sections. The polarizer covering the surface of the OEL display module is soft and easily scratched. Please be careful when handling the OEL display module. When the surface of the polarizer of the OEL display module has soil, clean the surface. It takes advantage of by using following adhesion tape. * Scotch Mending Tape No. 810 or an equivalent Never try to breathe upon the soiled surface nor wipe the surface using cloth containing solvent such as ethyl alcohol, since the surface of the polarizer will become cloudy. Also, pay attention that the following liquid and solvent may spoil the polarizer: * Water * Ketone * Aromatic Solvents Hold OEL display module very carefully when placing OEL display module into the system housing. Do not apply excessive stress or pressure to OEL display module. And, do not over bend the film with electrode pattern layouts. These stresses will influence the display performance. Also, secure sufficient rigidity for the outer cases.
Do not apply stress to the LSI chips and the surrounding molded sections. Do not disassemble nor modify the OEL display module. Do not apply input signals while the logic power is off. Pay sufficient attention to the working environments when handing OEL display modules to prevent occurrence of element breakage accidents by static electricity. * Be sure to make human body grounding when handling OEL display modules. * Be sure to ground tools to use or assembly such as soldering irons. * To suppress generation of static electricity, avoid carrying out assembly work under dry environments. * Protective film is being applied to the surface of the display panel of the OEL display module. Be careful since static electricity may be generated when exfoliating the protective film. 11) Protection film is being applied to the surface of the display panel and removes
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Univision Technology Inc.
Doc. www..com No: SAS1-E019-A
the protection film before assembling it. At this time, if the OEL display module has been stored for a long period of time, residue adhesive material of the protection film may remain on the surface of the display panel after removed of the film. In such case, remove the residue material by the method introduced in the above Section 5). 12) If electric current is applied when the OEL display module is being dewed or when it is placed under high humidity environments, the electrodes may be corroded and be careful to avoid the above.
8.2 Storage Precautions 1) When storing OEL display modules, put them in static electricity preventive bags avoiding exposure to direct sun light nor to lights of fluorescent lamps. and, also, avoiding high temperature and high humidity environment or low temperature (less than 0C) environments. (We recommend you to store these modules in the packaged state when they were shipped from Univision Technology Inc.) At that time, be careful not to let water drops adhere to the packages or bags nor let dewing occur with them. If electric current is applied when water drops are adhering to the surface of the OEL display module, when the OEL display module is being dewed or when it is placed under high humidity environments, the electrodes may be corroded and be careful about the above.
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8.3 Designing Precautions 1) The absolute maximum ratings are the ratings which cannot be exceeded for OEL display module, and if these values are exceeded, panel damage may be happen. To prevent occurrence of malfunctioning by noise, pay attention to satisfy the VIL and VIH specifications and, at the same time, to make the signal line cable as short as possible. We recommend you to install excess current preventive unit (fuses, etc.) to the power circuit (VDD). (Recommend value: 0.5A) Pay sufficient attention to avoid occurrence of mutual noise interference with the neighboring devices. As for EMI, take necessary measures on the equipment side basically. When fastening the OEL display module, fasten the external plastic housing section. If power supply to the OEL display module is forcibly shut down by such errors as taking out the main battery while the OEL display panel is in operation, we cannot guarantee the quality of this OEL display module. The electric potential to be connected to the rear face of the IC chip should be as follows: SSD1322 * Connection (contact) to any other potential than the above may lead to rupture of the IC.
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Univision Technology Inc.
8.4 Precautions when disposing of the OEL display modules 1)
Doc. www..com No: SAS1-E019-A
Request the qualified companies to handle industrial wastes when disposing of the OEL display modules. Or, when burning them, be sure to observe the environmental and hygienic laws and regulations.
8.5 Other Precautions 1) When an OEL display module is operated for a long of time with fixed pattern may remain as an after image or slight contrast deviation may occur. Nonetheless, if the operation is interrupted and left unused for a while, normal state can be restored. Also, there will be no problem in the reliability of the module. To protect OEL display modules from performance drops by static electricity rapture, etc., do not touch the following sections whenever possible while handling the OEL display modules. * Pins and electrodes * Pattern layouts such as the COF With this OEL display module, the OEL driver is being exposed. Generally speaking, semiconductor elements change their characteristics when light is radiated according to the principle of the solar battery. Consequently, if this OEL driver is exposed to light, malfunctioning may occur. * Design the product and installation method so that the OEL driver may be shielded from light in actual usage. * Design the product and installation method so that the OEL driver may be shielded from light during the inspection processes. Although this OEL display module stores the operation state data by the commands and the indication data, when excessive external noise, etc. enters into the module, the internal status may be changed. It therefore is necessary to take appropriate measures to suppress noise generation or to protect from influences of noise on the system design. We recommend you to construct its software to make periodical refreshment of the operation statuses (re-setting of the commands and re-transference of the display data) to cope with catastrophic noise.
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